发明名称 INLAID, INLAID WITH COVER, AND BOOKLET BODY
摘要 <p><P>PROBLEM TO BE SOLVED: To provide an inlaid which is suitably adaptable for a booklet body, or the like, while securing desired durability by preventing the damage of an IC module. <P>SOLUTION: An inlaid 40 is provided with an inlet 30 having an insulating substrate, an antenna coil 4 formed on the substrate, and an IC module 20 connected with the antenna 4; and a substrate 42 adhered to the inlet 30, in such a state that at least a portion of the upper face of the IC module 20 is exposed from an opening 43, wherein the distance between the internal wall of the opening 43 and the sidewall of the IC module 20 is equal to or more than a prescribed value, and the difference in level in between the upper face of the substrate 42 and the upper face of the IC module 20 is within a prescribed range, when the substrate 42 is pressed with a prescribed pressure. <P>COPYRIGHT: (C)2010,JPO&INPIT</p>
申请公布号 JP2010061269(A) 申请公布日期 2010.03.18
申请号 JP20080224689 申请日期 2008.09.02
申请人 TOPPAN PRINTING CO LTD 发明人 NAGAI HIDEYUKI;MIZUGUCHI YOSHIYUKI;TANAKA JUNSUKE
分类号 G06K19/077;B42D15/10;G06K19/07 主分类号 G06K19/077
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