| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method for a circuit board wherein a via hole is formed by a laser beam without giving a damage to the surface of a solder resist layer as well as in the process which removes the resin smear adhered to the via bottom without giving a damage on the surface of a solder resist layer. Ž<P>SOLUTION: From above a plastic film 2 adhered to the solder resist layer surface, a solder resist layer 1 formed on a circuit board 3 is irradiated with a laser beam L1, and thus a via hole 4 is formed in it. Further, after the via hole 4 is formed, desmear treatment is carried out in the plastic film 2 while the solder resist layer 1 is adhered. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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