IMPROVED WIRE GRID SUBSTRATE STRUCTURE AND METHOD FOR MANUFACTURING SUCH A SUBSTRATE

摘要

The present invention relates to a multi-layered substrate structure comprising at least one carrier layer (11),a first layer (12), said carrier layer and first layer being in contact with each other, and at least one second layer with a chemical composition different from the first layer(13) said first and second layer being in contact with each other, the second layer forming apertures each having at least one in-plane dimension (W1) smaller than the diffraction limit, the diffraction limit being defined by a radiation wavelength of the excitation light. The invention further relates to the use and manufacturing process of such a substrate structure and a luminescence sensor.