| 摘要 |
PURPOSE: A semiconductor package is provided to reduce the thickness of the whole semiconductor package by forming a groove on the lower side of the semiconductor chip and reducing the thickness of the adhesive unit. CONSTITUTION: A semiconductor chip(104) includes a bonding pad and a groove(H1). The groove is arranged on the opposite side of the bonding pad. A adhesive unit(106) is arranged in the grove to adhere the semiconductor chip. A connection unit(108) electrically connects the bonding pad and the substrate. The groove on the lower side of the semiconductor chip increases the thickness of the edge of the semiconductor chip.
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