| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an electronic apparatus having a substrate and an enclosure member made of materials having different thermal expansion coefficients, and controlling a gap caused by a difference or the like between the thermal expansion coefficients with a simple structure without increasing the number of components, and to provide a method of manufacturing the easy-to-produce and high-reliability electronic apparatus. <P>SOLUTION: A holding part 452 holding a protrusion part 304 moves in a Z-axis direction in accordance with an upper face enclosure member 300 moving in the Z-axis direction. An end part 458 of a long part 451 is formed continuously with the base body 400, so that the long part 451 does not move in the Z-axis direction. An elastic holding part 450 is inclined so that the end part 458 is located low and the tip of the holding part 452 is located high. The end part 458, the holding part 452 and a positioning hole part 303 are disposed from a low position to a high position in the Z-axis direction in this order. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
