SEMICONDUCTOR DEVICE

摘要

A semiconductor element (53) is provided with a diaphragm (72) arranged on an upper surface of a base (71) wherein a cavity (73) having a truncated pyramid shape vertically penetrates. A die boding pad (65) is arranged on an upper surface of a printed wiring-board-like substrate (52), and the lower surface of the semiconductor element (53) is bonded to the die bonding pad (65) with a die bonding resin (74). In the die bonding pad (65), an opening section (76) is formed by removing a region which faces a lower end of a valley section (75) generated on an inner circumference surface of the cavity (73) of the semiconductor element (53), and the die bonding pad (65) is prevented from being brought into contact with the lower end of the valley section (75).