| 摘要 |
PROBLEM TO BE SOLVED: To provide a jig for a semiconductor wafer that prevents not only smear and damage of a back surface of a circuit but also damage of the thin semiconductor wafer without a ring spacer when forming the circuit on a back-ground back surface of the semiconductor wafer. SOLUTION: The jig with a thin semiconductor wafer (W) having the back-ground back surface, and laminatable is equipped with: a body 1 of the jig which is hollow shaped and the diameter of which is more extended than that of the semiconductor wafer (W); and a plurality of elastic supporting strips 10 which are formed on the body 1 of the jig to support the semiconductor wafer (W). The elastic supporting strips are formed of: an inclined standing portion 11 which inclines and extends each of the elastic strips 10 from an inner peripheral portion of the body of the jig 1 to an upper inside thereof; and a holding portion 13 which is bent on the upper portion of the inclined standing portion 11 to horizontally support a peripheral portion of the semiconductor wafer (W). A combined sheet and the like are not in contact with the ground back surface to be free from smear even if the circuit is formed, for example, on the ground back surface, since any portion is not allowed to be in contact with the front and back of the semiconductor wafer (W). COPYRIGHT: (C)2010,JPO&INPIT |
