发明名称 COMPONENT PACKAGING ELEMENT
摘要 PROBLEM TO BE SOLVED: To provide a component packaging element that prevents foreign matter such as an adhesive, dust, and so on from being transferred to one face of a thin component, the one face being required to maintain its cleanness. SOLUTION: The component packaging element comprises: a first sheet 2 that is formed from a resin film 3 and an adhesive layer 4 applied to one side of the resin film 3 and that is formed larger than the outer shape of the thin component 1; and a second sheet 5 that formed of a resin film 6 made of a material to which foreign matter is less likely to be attached and that is formed larger than the outer shape of the thin component 1. The first and second sheets 2 and 3 are disposed so that the adhesive layer 4 of the first sheet 2 is opposed to the second sheet 5. The thin component 1 is disposed between these sheets 2 and 3 so that the one face that requires the maintenance of its cleanness is in contact with the second sheet 5. The first sheet 2 is stuck to the other side of the thin component 1 and the second sheet 5. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010058810(A) 申请公布日期 2010.03.18
申请号 JP20080226055 申请日期 2008.09.03
申请人 CASIO COMPUT CO LTD 发明人 HARADA TATSUHITO
分类号 B65D85/86;B65D75/30 主分类号 B65D85/86
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