SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

摘要

Provided is a semiconductor device having both electromagnetic wave shielding characteristics and reliability in a heating step at the time of mounting an electronic component in the semiconductor device.  The semiconductor device is provided with high-frequency mounted components (5, 6) mounted on a main surface of a circuit board (1).  The mounted components (5, 6) are electrically connected to a wiring pattern (4) on the main surface of the circuit board (1), a sealing body (7) composed of an insulating resin is formed so as to seal the mounted components (5, 6), metal particles are applied on the surface of the sealing body (7), and the applied metal particles are sintered.  Thus, an electromagnetic wave shield layer (2) is formed, and the electromagnetic wave shield layer (2) is electrically connected to a ground pattern (3) of the circuit board (1).