| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a solder-resist ink composition which suppresses increase in the temperature of an electronic component by enhancing a heat dissipation characteristic. <P>SOLUTION: Incorporation of carbon black having a high radiation factor in a far infrared region into the solder-resist ink composition allows increased radioactivity in the wavelength region of the solder-resist and efficient exhaustion of heat to the outside. As a result, the heat dissipation characteristic of the surface of a wiring board can be improved to suppress the increase in the temperature of the electronic component. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
