发明名称 BURN-IN SOCKET FOR WELP TYPE PACKAGE
摘要 PURPOSE: A burn-in socket for a WELP type package is provided to perform touch of a contact in a lead of the bottom of a package, thereby preventing damages to the lead during the test. CONSTITUTION: Probe units of contacts(20) implement electrical connection in the outside of a base. During upward movement, touch units of the contacts touches with a lead located in the bottom of a package unit. After a WELF type package is mounted, one pair of latches(40) are closed to fixe up/down movement of the WELF type package.
申请公布号 KR20100029974(A) 申请公布日期 2010.03.18
申请号 KR20080088701 申请日期 2008.09.09
申请人 OKINS ELECTRONICS CO., LTD. 发明人 JUN, JIN GUK;PARK, SUNG KYU;LEE, YONG KWAN
分类号 G01R31/26;H01L21/66 主分类号 G01R31/26
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