发明名称 |
BURN-IN SOCKET FOR WELP TYPE PACKAGE |
摘要 |
PURPOSE: A burn-in socket for a WELP type package is provided to perform touch of a contact in a lead of the bottom of a package, thereby preventing damages to the lead during the test. CONSTITUTION: Probe units of contacts(20) implement electrical connection in the outside of a base. During upward movement, touch units of the contacts touches with a lead located in the bottom of a package unit. After a WELF type package is mounted, one pair of latches(40) are closed to fixe up/down movement of the WELF type package. |
申请公布号 |
KR20100029974(A) |
申请公布日期 |
2010.03.18 |
申请号 |
KR20080088701 |
申请日期 |
2008.09.09 |
申请人 |
OKINS ELECTRONICS CO., LTD. |
发明人 |
JUN, JIN GUK;PARK, SUNG KYU;LEE, YONG KWAN |
分类号 |
G01R31/26;H01L21/66 |
主分类号 |
G01R31/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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