PURPOSE: A soldering device of superconducting tapes is provided to minimize junction resistance by forming the thickness of soldering constant. CONSTITUTION: A supporting plate(10) has a groove(12) into which a superconducting wire to be welded is inserted. A heating unit heats and pressure the superconducting wire inserted into the groove so that the superconducting wire is soldered. A pressure control unit(40) controls the pressure to the superconducting wire. The heating unit comprises an electric heater and protruded heating blade. The heating blade is combined with the heating unit and is replaceable.
申请公布号
KR20100030317(A)
申请公布日期
2010.03.18
申请号
KR20080089210
申请日期
2008.09.10
申请人
KOREA ELECTROTECHNOLOGY RESEARCH INSTITUTE
发明人
SOHN, MYUNG HWAN;SIM, KI DEOK;KIM, SEOK HO;BAE, JOON HAN;LEE, EON YOUNG