PURPOSE: A side-view light emitting diode package is provided to reduce the loss of a light due to the absorption or the scattering of the light in an opening by forming a trapezoidal shape opening. CONSTITUTION: A side-view light emitting diode package includes a light emitting diode chip(37), a package body(35) and an opening(36). The light emitting diode chip is placed over the center axis. The package body includes the opening which exposes the light emitting diode chip. The upper side of the opening is trapezoidal shape. The package body includes long sides and short sides. A first and a second lead frames which is arranged on the lower side of the opening are expanded to the direction of the sides of the package body.
申请公布号
KR20100030139(A)
申请公布日期
2010.03.18
申请号
KR20080088934
申请日期
2008.09.09
申请人
SEOUL SEMICONDUCTOR CO., LTD.
发明人
HAN, JEONG A;JANG, MI YOUN;SO, JI SEOP;CHOI, SEUNG LI