发明名称 |
FLEXIBLE CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME, DROPLET DISCHARGE HEAD, DROPLET DISCHARGE DEVICE, AND SEMICONDUCTOR DEVICE |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a flexible circuit board and a method of manufacturing the same, which are for achieving good connection and improving mounting efficiency; a high reliability and miniaturized droplet discharge head; and a droplet discharge device and a semiconductor device, which secure long-term connection reliability. <P>SOLUTION: The droplet discharge head 1 is composed of a plurality of terminals each arranged in one direction on a first surface of a flexible substrate 71, and includes a pair of terminal rows arranged in substantially parallel with each other and wiring patterns each extended from each terminal of the pair of terminal rows. The droplet discharge head 1 includes a flexible circuit board 27 in which the terminal rows are arranged oppositely via a through-hole 80 formed by passing through the flexible substrate 71. <P>COPYRIGHT: (C)2010,JPO&INPIT |
申请公布号 |
JP2010062494(A) |
申请公布日期 |
2010.03.18 |
申请号 |
JP20080229473 |
申请日期 |
2008.09.08 |
申请人 |
SEIKO EPSON CORP |
发明人 |
KORI TOSHIAKI |
分类号 |
H05K1/02;B41J2/045;B41J2/055;B41J2/135;B41J2/14;B41J2/16;H01L41/09;H01L41/18;H01L41/22;H05K3/36 |
主分类号 |
H05K1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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