| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a positive photosensitive composition for a solid state imaging device which is superior in developability and in pattern formation, produces highly refractive cured film, and forms a pattern with ease. <P>SOLUTION: The resin composition includes: (A) at least one selected from a polyamic acid with a predetermined structure and an imidized polymer of the polyamic acid with the predetermined structure; (B) particles including an oxide of an element of the fourth group of the periodic table as a main component and having a particle size of 1-100 nm measured with dynamic light scattering; (C) a quinone diazide compound; and (D) an organic solvent, wherein the content of (C) the quinone diazide compound is in the range of 10-40 wt.% when the sum total of components in the composition excluding (D) the organic solvent is set to 100 wt.%. <P>COPYRIGHT: (C)2010,JPO&INPIT |
