| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a wiringd circuit board which has excellently maintained transmission characteristics and improved strength, and a method of manufacturing the same. <P>SOLUTION: On a suspension body portion 10, a first insulating layer 41 is formed. A wiring pattern W1 for writing is formed on the first insulating layer 41. On the first insulating layer 41, a second insulating layer 42 is formed covering the wiring pattern W1 for writing. On the second insulating layer 42, a pattern W2 for wiring and wiring patterns R1 and R2 for reading are formed. The wiring pattern W2 for writing is disposed above the wiring pattern W1 for writing. The wiring pattern W2 for writing includes a conductor layer W2a and alloy layers W2b and W2c for reinforcement. The alloy layers W2b and W2c for reinforcement are formed in order so as to cover an upper surface and a side surface of the conductor layer W2a. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
