| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a resin composition package having high dimensional accuracy, low warping, low thermal expansion, and high heat resistance based on a thermosetting resin. Ž<P>SOLUTION: The fire-resistant resin composition for molding contains, as essential components, (A) an epoxy resin having a naphthalene skeleton having a predetermined structure, (B) a phenol aralkyl resin curing agent having a predetermined structure, (C) a bisphenol-A-type epoxy resin having a flexible skeleton and a polar skeleton, (D) a curing accelerator, and (E) a fused silica powder whose mass average particle diameter is 10-30 μm. The fused silica powder (E) is contained in the resin composition for molding in an amount of 80-90 mass%, and the resin composition for molding does not contain a halogen atom. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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