| 摘要 |
PROBLEM TO BE SOLVED: To provide a cutting processing apparatus and a cutting processing method which can facilitate separation without damaging a device formed on a wafer surface, and can efficiently remove contamination remaining in a gap between a wafer and a protection member. SOLUTION: The work W is cut while a fluid 21 is supplied by a fluid supply means 11 from a processing groove 20 to the gap 19 between the protection member 16 and wafer 15. COPYRIGHT: (C)2010,JPO&INPIT |
