| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a highly reliable semiconductor device by improving bondability between leads and a sealing resin (molding resin) to prevent peeling. <P>SOLUTION: The semiconductor device includes a semiconductor chip, a plurality of leads electrically connected to the semiconductor chip and containing a metal as a main constituting material, and a resin for sealing the semiconductor chip. In the semiconductor device, the plurality of leads each have an outer lead exposed from the resin and an inner lead embedded in the resin, the resin contains an aromatic compound having a benzene ring and/or a compound having a cyclohexane ring and the leads are arranged so that the benzene ring and/or cyclohexane ring contained in the resin in an interface where the surface material of each of the inner leads contacts the resin may be superimposed on the metal atoms as the main constituting material of the surface material of each of the inner leads. <P>COPYRIGHT: (C)2010,JPO&INPIT |
