发明名称 MULTILAYER CERAMIC CIRCUIT SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a method of manufacturing a multilayer ceramic circuit substrate. SOLUTION: The method of manufacturing the multilayer ceramic circuit substrate includes steps of: forming a plurality of ceramic blocks, in each of which one or more ceramic green sheets including via-electrodes are laminated on one another; respectively baking the plurality of ceramic blocks; aligning the plurality of baked ceramic blocks; arranging one or more bonding green sheets each having bonding electrodes formed thereon in positions corresponding to the via-electrodes included in the plurality of ceramic blocks; interposing each of the bonding green sheets between a pair of the ceramic blocks opposing each other within the plurality of aligned ceramic blocks; and bonding the plurality of ceramic blocks and the bonding green sheets to each other to be baked. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010062522(A) 申请公布日期 2010.03.18
申请号 JP20090079752 申请日期 2009.03.27
申请人 SAMSUNG ELECTRO-MECHANICS CO LTD 发明人 YOO WON HEE;CHANG BYEUNG GYU;LEE TAEK JUNG;KIM YONG SUK
分类号 H05K3/46 主分类号 H05K3/46
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