发明名称 |
MULTILAYER CERAMIC CIRCUIT SUBSTRATE AND METHOD OF MANUFACTURING THE SAME |
摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a multilayer ceramic circuit substrate. SOLUTION: The method of manufacturing the multilayer ceramic circuit substrate includes steps of: forming a plurality of ceramic blocks, in each of which one or more ceramic green sheets including via-electrodes are laminated on one another; respectively baking the plurality of ceramic blocks; aligning the plurality of baked ceramic blocks; arranging one or more bonding green sheets each having bonding electrodes formed thereon in positions corresponding to the via-electrodes included in the plurality of ceramic blocks; interposing each of the bonding green sheets between a pair of the ceramic blocks opposing each other within the plurality of aligned ceramic blocks; and bonding the plurality of ceramic blocks and the bonding green sheets to each other to be baked. COPYRIGHT: (C)2010,JPO&INPIT |
申请公布号 |
JP2010062522(A) |
申请公布日期 |
2010.03.18 |
申请号 |
JP20090079752 |
申请日期 |
2009.03.27 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO LTD |
发明人 |
YOO WON HEE;CHANG BYEUNG GYU;LEE TAEK JUNG;KIM YONG SUK |
分类号 |
H05K3/46 |
主分类号 |
H05K3/46 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|