| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an appearance inspection device capable of largely improving inspection efficiency in a chip part by easily and surely removing overlapped chip parts before inspecting appearance. Ž<P>SOLUTION: This appearance inspection device inspects its appearance by imaging the chip parts successively supplied to a predetermined carrying passage 14 from part supply mechanisms 2 and 4 by cameras 18a-18f. The part supply mechanisms have removing mechanisms 32 for removing the overlapped chip parts vertically overlapped in a plurality of the chip parts by excluding the chip parts from a supply object to the carrying passage. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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