| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device and an apparatus for manufacturing the semiconductor device that reduce cracking, chipping, and curving of a wafer while suppressing the production cost. SOLUTION: A stage 1 incldues a base portion 2, a large-diameter movable portion 3, and a small-diameter movable portion 4. The large-diameter movable portion 3 is provided inside the base portion 2 to be elevated. The small-diameter movable portion 4 is elevatably provided inside the large-diameter movable portion 3. In accordance with the diameter and depth of a recessed portion of the wafer 60 having the recessed portion formed at the center part of the reverse surface thinner than an outer peripheral end, only the small-diameter movable portion 4 or both the small-diameter movable portion 4 and the large-diameter movable portion 3 are elevated to form a projection portion at the center part of the stage 1. The wafer 60 is installed on the stage 1 such that the projection portion enters the recessed portion of the wafer 60, and the wafer 60 is processed by dicing etc., from the top surface side of the wafer 60. COPYRIGHT: (C)2010,JPO&INPIT
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