发明名称 FILM DEPOSITION SYSTEM AND FILM DEPOSITION METHOD
摘要 PROBLEM TO BE SOLVED: To provide a film deposition system and a film deposition method which control the feed of the evaporation gas made to flow into a film deposition chamber so as to fixedly retain a film deposition rate, and also can deposit a polymer film of high quality. SOLUTION: The film deposition system includes: a vacuum film deposition chamber 10 in which the object S for film deposition is installed; evaporation sources 21a, 21b sealed with raw material monomers Ma, Mb; and heating means 22a, 22b provided at the evaporation sources. A raw material pipe connecting the vacuum film deposition chamber and the evaporation sources is provided with conductance variable valves 31a, 31b and manometers 32a, 32b, and further, the conductance variable valves are provided with control sections 33a, 33b controlling the opening degrees of the conductance variable valves in such a manner that the pressure value measured with the manometers is made equal to the set pressure value in the conductance variable valves. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010059507(A) 申请公布日期 2010.03.18
申请号 JP20080227539 申请日期 2008.09.04
申请人 ULVAC JAPAN LTD 发明人 IRIKURA HAGANE
分类号 C23C14/24;C23C14/12 主分类号 C23C14/24
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