| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition capable of obtaining a resist pattern excellent particularly in sensitivity, resolution and stripping characteristics of the resist, to provide a photosensitive element using the photosensitive resin composition, and to provide a method for forming a resist pattern and a method for manufacturing a printed wiring board. <P>SOLUTION: The photosensitive resin composition comprises: (A) a binder polymer comprising a copolymer composition having structural units expressed by general formulae (I), (II) and (III); (B) a photopolymerizable compound; and (C) a photopolymerization initiator. The photosensitive element, the method for forming a resist pattern and the method for manufacturing a printed wiring board are achieved by using the above composition. In the formulae, each R<SP>1</SP>independently represents a hydrogen atom or methyl group; each R<SP>2</SP>independently represents 1-3C alkyl group, 1-3C alkoxy group, OH group or a halogen atom; R<SB>3</SB>represents a substituent containing a radical polymerizable unsaturated double bond; and m is an integer from 0 to 5. <P>COPYRIGHT: (C)2010,JPO&INPIT |
