| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a TAB (Tape Automated Bonding) tape for a semiconductor device by which a solder ball is reliably bonded on a surface of a conductor foil in an exposed part as a via hole for mounting a solder ball, and the degradation and a short life of a bonding tool can be prevented, and to provide a method of manufacturing the same. <P>SOLUTION: The TAB tape 10 for a semiconductor device includes an insulating substrate 1 on which the via hole 3 for mounting a solder ball and a window hole 4 for bonding are pierced, and a conductor pattern 2 having at least a wiring pattern 5 and an inner lead 6 formed by patterning the conductor foil 11 adhered on one surface of the insulating substrate 1. Surface roughness of a surface 7 of the conductor pattern 2 of an exposed part through the via hole 3 for mounting a solder ball and of an exposed part through the window hole 4 for bonding is less than surface roughness of a surface 8 of a part adhered to the one surface of the insulating substrate 1. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
