发明名称 AUTOMATIC WIRING DEVICE, AUTOMATIC WIRING METHOD, AND AUTOMATIC WIRING PROGRAM
摘要 PROBLEM TO BE SOLVED: To achieve a high density LSI while properly preventing the minimum metal area error. SOLUTION: An automatic wiring device 10 divides the metal area into rectangles, calculates the area of each divided rectangle, calculates the total area of the rectangles, and then decides whether the metal area thus calculated is smaller than a predetermined threshold, i.e. the minimum metal area. If a decision is made that the metal area is smaller than the minimum metal area, the automatic wiring device 10 corrects the wiring of the LSI so that the metal area becomes equal to or larger than the minimum metal area. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010062227(A) 申请公布日期 2010.03.18
申请号 JP20080224116 申请日期 2008.09.01
申请人 FUJITSU LTD 发明人 KATAGIRI HIDEAKI
分类号 H01L21/82;G06F17/50 主分类号 H01L21/82
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