| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a wiring board, and the wiring board by which a terminal for external connection as a part for forming a bump and also a conductor pattern continuing from it can be made fine without causing degradation of manufacture yields and degradation of reliability of manufactured wiring boards as products. Ž<P>SOLUTION: The conductor pattern 4 is formed by filling a conductor in an opening pattern 3A of a first resist 3 to a height less than a thickness of the first resist 3 by an electric plating method. After forming the conductor pattern 4, the bump 6 is formed by filling the conductor in a part of the terminal 4<SB>-2</SB>for external connection, which is exposed from the opening pattern 3A of the first resist 3 and also is exposed from an opening 5A of the second resist 5, to a height not higher than the thickness of the first resist 3 by using a surface of the terminal 4<SB>-2</SB>for external connection of the exposed part as an electrode by the electric plating method. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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