| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat sink of a semiconductor circuit element in which reduction in manufacturing cost, and size reduction and stable attachment of a member can be achieved by modifying a temporary anchoring structure of a fixing bolt of the heat sink. SOLUTION: A clamp cap 25 has an annular barrel portion 26 externally engaged below a barrel portion 21 of a bolt body 20, and the annular barrel portion 26 is attached to the barrel portion 21 by calking to make a lower apparent external diameter of the barrel portion 21 larger than the internal diameter of a bolt receiving hole 15 of the heat sink body 10, thereby temporarily anchoring a bolt unit 2 for fixation to the heat sink body 10. The need for an E clip, etc. is eliminated when the bolt unit 2 is temporarily anchored to the heat sink body 10 and the clamp cap 25 is anchored by calking to the barrel portion 21 to simplify the constitution of the bolt body 20, thereby constituting the heat sink 1 at low cost. COPYRIGHT: (C)2010,JPO&INPIT
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