| 摘要 |
PROBLEM TO BE SOLVED: To provide a tray for substrate mounting that reduces a risk of breakage of a microstructure during conveyance and enables the microstructure to be accurately evaluated when the microstructure is evaluated. SOLUTION: The tray 11 for substrate mounting includes a mounting portion 12 for mounting a wafer W on a surface, and a plurality of contact portions 21a abutting on an outer edge 13 of the wafer W mounted on the mounting portion 12. Here, the plurality of contact portions 21a including a microspring 22 etc., are able to contact and leave the outer edge 13 of the wafer W mounted on the mounting portion 12. COPYRIGHT: (C)2010,JPO&INPIT |
