发明名称 METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a method by which a semiconductor device including a thin film transistor with excellent electric characteristics and high reliability is manufactured with a small number of steps. <P>SOLUTION: After a channel protective layer is formed over an oxide semiconductor film containing In, Ga and Zn, a film having n-type conductivity and a conductive film are formed, and a resist mask is formed over the conductive film. The conductive film, the film having the n-type conductivity, and the oxide semiconductor film containing In, Ga and Zn are etched using the channel protective layer and gate insulating films as etching stoppers with the resist mask, so that source and drain electrode layers, a buffer layer, and a semiconductor layer are formed. <P>COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010062549(A) 申请公布日期 2010.03.18
申请号 JP20090182980 申请日期 2009.08.06
申请人 SEMICONDUCTOR ENERGY LAB CO LTD 发明人 MIYAIRI HIDEKAZU;AKIMOTO KENGO;NAKAMURA YASUO
分类号 H01L21/336;G02F1/1368;H01L21/28;H01L29/417;H01L29/786;H01L51/50 主分类号 H01L21/336
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