| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a multilayer printed wiring board that reduces generation of unwanted radiation noise during operation as compared with before. <P>SOLUTION: The multilayer printed wiring board has, as an inner layer, a power supply layer 24 for supplying driving voltages different by conductor patterns 14, 16 and 18 to an electronic component provided with insulated discontinuous parts to be divided into the conductor patterns 14, 16 and 18 and mounted. The multilayer printed wiring board is characterized in that a plurality of inter-power-source bypass capacitors 12 for connecting the conductor patterns 14, 16 and 18 in terms of high frequency are mounted on surfaces moved vertically with a posture parallel to surfaces of the inner layer where the discontinuous parts are provided, and/or an inter-power-source-ground bypass capacitor 52 for connecting the conductor patterns 14, 16 and 18, and a GND layer 36 in terms of high frequency is mounted on an inner layer surface moved vertically with a posture parallel to peripheral edges of the conductor patterns 14, 16 and 18. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
