| 发明名称 |
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME |
| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a printed circuit board capable of improving a bonding force between a circuit pattern formed in an inkjet system and an insulating layer, and to provide a method of manufacturing the same. <P>SOLUTION: A manufacturing method of a printed circuit board includes a step of forming an electroless plating layer on an insulating layer and a step of forming a circuit pattern by applying conductive ink on the electroless plating layer by making use of an ink jet system. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
| 申请公布号 |
JP2010062525(A) |
申请公布日期 |
2010.03.18 |
| 申请号 |
JP20090112205 |
申请日期 |
2009.05.01 |
| 申请人 |
SAMSUNG ELECTRO-MECHANICS CO LTD |
发明人 |
KIM TAE-HOON;KIM DONG-HOON;LEE YOUNG-IL;LEE SANG-GYUN;JUN BYUNG-HO;SHIM DA-MI |
| 分类号 |
H05K3/10;H05K3/18 |
主分类号 |
H05K3/10 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
