发明名称 |
APPARATUS AND METHOD OF FORMING SEMICONDUCTOR DEVICES |
摘要 |
An apparatus to form semiconductor devices includes an inner tube and an outer tube disposed to surround the inner tube. A plate is disposed at first open end of the inner tube to reduce variation between pressures at a first portion and a second portion inside the inner tube. The sum of areas of through-holes disposed on the plate is 10 to 60 percent of the entire area of the plate. The through-holes may include a first through-hole that is disposed at a central portion of the plate, and second through-holes disposed at an edge portion of the plate. The second through-holes are annularly arranged to surround the first through-hole.
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申请公布号 |
US2010064970(A1) |
申请公布日期 |
2010.03.18 |
申请号 |
US20090545983 |
申请日期 |
2009.08.24 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD |
发明人 |
PARK YOUNGSOO;AHN JUNGIL;KIM MYEONGJIN;CHA SANGYEOB;HWANG WANGOO;AN YOUNGSAM |
分类号 |
H01L21/465 |
主分类号 |
H01L21/465 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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