| 摘要 |
Especially for but not limited to lead-free solder, the apparatus disclosed herein will provide better quality of wave soldered joints at a lower cost, without the addition of more equipment. The invention will form complete TH solder joints over the first wave soldering nozzle, not the second wave soldering nozzle which is current art. It specifically addresses the size and the shape of the holes in the first wave-forming nozzle. The first solder wave forming plate has hexagon shaped holes that reduce the incidence of holes being clogged and non-functional. There is a size gradient across the multiple rows of holes in the extended contact wave former that has the effect of creating a uniform solder pressure across the entire face of the nozzle. The result is higher solder pressure against the electronic substrate being soldered for a longer period of time than current art, allowing for faster formation of solder joints. This affects quality and thru-put.
|
