| 摘要 |
Structures and methods of forming stacked chips are disclosed. In one embodiment, a first chip is disposed over a second chip, a top surface of the first and the second chip includes active circuitry. A first through substrate via is disposed within the first chip, the first through substrate via includes a protruding tip projecting below a bottom surface of the first chip, the bottom surface being opposite the top surface. A second through substrate via is disposed on the second chip, the second through substrate via including an opening, wherein the first protruding tip of the first chip is disposed within the opening of the second chip.
|
