PAPER CUP MANUFACTURE WITH MICROENCAPSULATED ADHESIVE
摘要
Paper cup manufacture utilizing microencapsulated adhesive typically includes: (a) supplying a paperboard web to a coating line; (b) coating the web in the coating line with a liquid resistant coating in a first predetermined pattern on a first side thereof corresponding to interior surfaces of sidewalls of paperboard cups formed from the paperboard blanks; (c) coating the web in the coating line with a microencapsulated adhesive in a second predetermined pattern corresponding to seams of paperboard cups formed from the paperboard blanks, the microencapsulated adhesive thereby being applied in common registry with the liquid resistant coating in the coating line; and (d) cutting paperboard blanks from the web. The paperboard blanks are then (e) formed into the cup sidewall with the adhesive securing a seam.
申请公布号
WO2010011663(A3)
申请公布日期
2010.03.18
申请号
WO2009US51273
申请日期
2009.07.21
申请人
DIXIE CONSUMER PRODUCTS LLC;SWOBODA, DEAN, P.;VAN EYCK, TIMOTHY, L.