SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

摘要

PURPOSE: A semiconductor package and a manufacturing method thereof is provided so that the resistivity about the load actuating on a semiconductor package on a traverse direction can be improved after a semiconductor package is welded with the solder bump in an external device. CONSTITUTION: A semiconductor package comprises a substrate(110), an insulating layer(130), a metal post(170), and a solder bump(180). In substrate, a conductive pattern(120) is formed in single-side. An insulating layer is formed in the single-side of substrate. And the penetration hole is formed so that the conductive pattern expose. One end is close to the conductive pattern and the metal post is formed in the penetration hole so that the other end depress. A solder bump is formed in the other end of the metal post.