| 摘要 |
<p>To provide a semiconductor package provided with a semiconductor device; a semiconductor substrate having the semiconductor device arranged on one surface; a cap substrate having one surface that opposes the one surface of the semiconductor substrate via a gap; a spacer that is arranged between the one surface of the semiconductor substrate and the one surface of the cap substrate, and that joins the semiconductor substrate and the cap substrate; and a filter that is provided on the cap substrate so as to overlap with the semiconductor device without overlapping with the spacer. According to the present invention, it is possible to provide a semiconductor package that can suppress exfoliation of the filter by chipping during the dicing step, and a method of manufacturing the semiconductor package.</p> |
