发明名称 |
RESIN LAMINATED FILM FOR FORMING BLISTER PACK AND BLISTER PACK |
摘要 |
<p>Blister packaging multilayer resin films and blister packages of the invention achieve a lower oxygen permeability than possible heretofore. A blister packaging multilayer resin film of the invention is used to produce a blister package in which an item is sealed between a support substrate and the multilayer resin film, wherein the multilayer resin film includes an oxygen barrier layer that is arranged on a side of the multilayer resin film which side faces the support substrate, and a moisture proof layer that is arranged on a side of the oxygen barrier layer which side does not face the support substrate.</p> |
申请公布号 |
EP2163379(A1) |
申请公布日期 |
2010.03.17 |
申请号 |
EP20080777218 |
申请日期 |
2008.06.13 |
申请人 |
SHIONOGI&CO., LTD.;TAISEI KAKO CO., LTD. |
发明人 |
TAMURA, TAKUMI;HIRAMOTO, SHINJI;HAMAMOTO, KEIJI;TSUJI, TAKUYA |
分类号 |
A61J1/03;B32B27/08;B32B27/30;B32B27/32;B65D65/40;B65D75/32;B65D75/36;B65D83/04 |
主分类号 |
A61J1/03 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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