发明名称 RESIN LAMINATED FILM FOR FORMING BLISTER PACK AND BLISTER PACK
摘要 <p>Blister packaging multilayer resin films and blister packages of the invention achieve a lower oxygen permeability than possible heretofore. A blister packaging multilayer resin film of the invention is used to produce a blister package in which an item is sealed between a support substrate and the multilayer resin film, wherein the multilayer resin film includes an oxygen barrier layer that is arranged on a side of the multilayer resin film which side faces the support substrate, and a moisture proof layer that is arranged on a side of the oxygen barrier layer which side does not face the support substrate.</p>
申请公布号 EP2163379(A1) 申请公布日期 2010.03.17
申请号 EP20080777218 申请日期 2008.06.13
申请人 SHIONOGI&CO., LTD.;TAISEI KAKO CO., LTD. 发明人 TAMURA, TAKUMI;HIRAMOTO, SHINJI;HAMAMOTO, KEIJI;TSUJI, TAKUYA
分类号 A61J1/03;B32B27/08;B32B27/30;B32B27/32;B65D65/40;B65D75/32;B65D75/36;B65D83/04 主分类号 A61J1/03
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