| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a printed board with a conductive bump possible to be contacted with other printed boards much better, and provide a manufacturing method of the printed board. SOLUTION: Copper foil is formed on one side of an insulating board 4 and two sheets of peeling films are formed on the other side of the insulating board 4. A via hole 7 passed from the face of the insulating board 4 to the copper foil 2 is formed and filled with conductive paste 8. The upper peeling film is peeled to expose a part of conductive paste 8, and the conductive paste 8 is pressed. As a result, the printed board 1 with a non-convex shaped conductive bump 3 on the upper side can be provided by peering the lower peeling film 6.</p> |
