| 摘要 |
A process for producing a sound absorber having skin layers constituting front and back surfaces and, interposed between the skin layers, a void layer having a plurality of pin formed holes, each hole having a depth which is enough to penetrate one of the skin layers and is not enough to reach the other skin layer. The sound absorber is formed of a resin material containing 2 to 60 wt % of reinforcing fibers with a length of 2 to 100 mm. |
