| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide an IC package mounting board which is capable of reducing the board in size without increasing its cost even if the board is equipped with through-vias. SOLUTION: A flat terminal IC package 20 which is equipped with a group of narrow-pitch terminals 18 arranged in a two-dimensional manner is mounted on the one surface 12 of a board 10 equipped with a group of through-vias 16, while the narrow-pitch terminals 18 are electrically connected to the through- vias 16 at a group of lands 30, and a peripheral terminal IC package 24 equipped with lead terminals 22 at its periphery is mounted on the other surface 14. The peripheral terminal IC package 24 is larger in size than the narrow-pitch terminals 18 of the planar terminal IC package 20 and mounted at a position so as to cover the through-vias 16.</p> |
