发明名称 |
Electronic assembly cooling |
摘要 |
An electronic assembly including a first heat producing device mounted on a first outer surface of a first portion of a circuit board. The first portion can deflect upwardly and downwardly relative to other portions of the circuit board. A first force element urges the first heat producing device against a heat sink. The force exerted by the first force element is variable with respect to time.
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申请公布号 |
US7679917(B2) |
申请公布日期 |
2010.03.16 |
申请号 |
US20080019712 |
申请日期 |
2008.01.25 |
申请人 |
DECK JOSEPH F;HUNTER BRADLEY L;NUSSBAUM MICHAEL B;OWEN STEVEN D |
发明人 |
DECK JOSEPH F.;HUNTER BRADLEY L.;NUSSBAUM MICHAEL B.;OWEN STEVEN D. |
分类号 |
H05K7/20;F28F7/00;H01L23/34 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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