发明名称 System and method for manufacturing flexible copper clad laminate film
摘要 Disclosed is a system and a method for manufacturing flexible copper clad laminate film capable of efficiently electroplating both surfaces of a polyimide-based film to form copper plating layers thereon while making it easy to repair and maintain the apparatus or clean its plating or cleaning bath. The system includes a pickling device adapted to spray a pickling liquid to both surfaces of a to-be-plated film to remove oxide coatings from the copper coatings; a number of water-cleaning devices for removing the pickling liquid and copper electrolyte remaining on the film; at least one plating device positioned between the water-cleaning devices to form copper plating layers on both surfaces of the film; an antirust device for preventing the copper plating layers, which have been formed by the plating device, from rusting; and a drying device for drying the antirust liquid on the film, which has been subjected to antirust treatment.
申请公布号 US7678242(B2) 申请公布日期 2010.03.16
申请号 US20050294221 申请日期 2005.12.05
申请人 KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY 发明人 LEE HONG KEE;SON SEONG-HO;KOO SEOK BON
分类号 C25D17/00 主分类号 C25D17/00
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