发明名称 Semiconductor device, and method and apparatus for manufacturing the same
摘要 A SiO2 film is formed on a semiconductor substrate. Then, a SiN film is formed on the SiO2 film. In this event bis(tertiary butyl amino) silane and NH3 are used as a material gas, and the film forming temperature is set to 600° C. or lower.
申请公布号 US7678711(B2) 申请公布日期 2010.03.16
申请号 US20050147212 申请日期 2005.06.08
申请人 FUJITSU MICROELECTRONICS LIMITED 发明人 HORI MITSUAKI;OHTA HIROYUKI;OOKOSHI KATSUAKI
分类号 H01L21/31;C23C16/00;C23C16/02;C23C16/34;H01L21/28;H01L21/314;H01L21/318;H01L21/8234;H01L29/51;H01L29/76;H01L29/78 主分类号 H01L21/31
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