发明名称 |
Method of manufacturing semiconductor device |
摘要 |
A method for manufacturing a semiconductor device includes: a step of forming a via plug erected on an electrically conductive layer, and embedding the via plug in an insulation layer to form a wiring structure; and a step of bonding the wiring structure to a wiring substrate including electronic components mounted thereon.
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申请公布号 |
US7678612(B2) |
申请公布日期 |
2010.03.16 |
申请号 |
US20070898973 |
申请日期 |
2007.09.18 |
申请人 |
SHINKO ELECTRIC INDUSTRIES CO., LTD. |
发明人 |
FUJII TOMOHARU;OI KIYOSHI |
分类号 |
H01L21/00 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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