| 发明名称 |
Semiconductor package with redistributed pads |
| 摘要 |
A method for fabricating a semiconductor package which includes coupling an electrode of a semiconductor device to a portion of a lead frame, overmolding at least a portion of the die, and then removing a portion of the die to obtain a desired thickness.
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| 申请公布号 |
US7678609(B2) |
申请公布日期 |
2010.03.16 |
| 申请号 |
US20060592408 |
申请日期 |
2006.11.03 |
| 申请人 |
INTERNATIONAL RECTIFIER CORPORATION |
发明人 |
PAVIER MARK |
| 分类号 |
H01L21/44;H01L21/48;H01L21/50 |
主分类号 |
H01L21/44 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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