| 发明名称 |
Flexible substrate with electronic devices formed thereon |
| 摘要 |
A method of manufacturing an electronic device (10) provides a substrate (20) that has a plastic material. A particulate material (16) is embedded in at least one surface of the substrate. A layer of thin-film semiconductor material is deposited onto the substrate (20).
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| 申请公布号 |
US7678701(B2) |
申请公布日期 |
2010.03.16 |
| 申请号 |
US20060461080 |
申请日期 |
2006.07.31 |
| 申请人 |
EASTMAN KODAK COMPANY |
发明人 |
TREDWELL TIMOTHY J.;KERR ROGER S. |
| 分类号 |
H01L21/302 |
主分类号 |
H01L21/302 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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