发明名称 Circuitized substrate with shielded signal lines and plated-thru-holes and method of making same, and electrical assembly and information handling system utilizing same
摘要 A circuitized substrate in which selected ones of the signal conductors are substantially surrounded by shielding members which shield the conductors during passage of high frequency signals, e.g., to reduce noise. The shielding members may form solid members which lie parallel and/or perpendicular to the signal conductors, and may also be substantially cylindrical in shape to surround a conductive thru-hole which also forms part of the substrate. An electrical assembly and an information handling system are also defined.
申请公布号 US7679005(B2) 申请公布日期 2010.03.16
申请号 US20060401401 申请日期 2006.04.11
申请人 ENDICOTT INTERCONNECT TECHNOLOGIES, INC. 发明人 CHAN BENSON;EGITTO FRANK D.;MAGNUSON ROY H.;MARKOVICH VOYA R.;THOMAS DAVID L.
分类号 H01R12/04;H01K3/10;H05K1/11 主分类号 H01R12/04
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