发明名称 LED housing and fabrication method thereof
摘要 In an LED housing, a heat conducting part has a chip mounting area, a heat connecting area opposed to the chip mounting area and a groove formed adjacent to the heat connecting area. An electrical connecting part has a wiring area placed adjacent to the chip mounting area and an external power connecting area led to the wiring area. A housing body is made of molding resin, and integrally holds the heat conducting part and the electrical connecting part while isolating the electrical connecting part from the heat conducting part. The housing body is provided with a recess extended from a portion of the groove of the heat conducting part to a side of the housing body.
申请公布号 US7678592(B2) 申请公布日期 2010.03.16
申请号 US20070680847 申请日期 2007.03.01
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 LEE SEON GOO;JIN BUM JOON;HAN KYUNG TAEG;KIM CHANG WOOK
分类号 H01L21/00;H01L33/56;H01L33/60;H01L33/62;H01L33/64 主分类号 H01L21/00
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