发明名称 |
LED housing and fabrication method thereof |
摘要 |
In an LED housing, a heat conducting part has a chip mounting area, a heat connecting area opposed to the chip mounting area and a groove formed adjacent to the heat connecting area. An electrical connecting part has a wiring area placed adjacent to the chip mounting area and an external power connecting area led to the wiring area. A housing body is made of molding resin, and integrally holds the heat conducting part and the electrical connecting part while isolating the electrical connecting part from the heat conducting part. The housing body is provided with a recess extended from a portion of the groove of the heat conducting part to a side of the housing body.
|
申请公布号 |
US7678592(B2) |
申请公布日期 |
2010.03.16 |
申请号 |
US20070680847 |
申请日期 |
2007.03.01 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
LEE SEON GOO;JIN BUM JOON;HAN KYUNG TAEG;KIM CHANG WOOK |
分类号 |
H01L21/00;H01L33/56;H01L33/60;H01L33/62;H01L33/64 |
主分类号 |
H01L21/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|